SMC Joins Innovative Packaging Panel During the Future of Packaging Conference, Chicago, IL May 8

SMC’s Mike Fritschy, VP Engineering and Product Development, will be part of a panel of speakers during the Future of Packaging Conference held in Chicago IL, May 8, 2019. The panel will discuss topics such as: how medical OEM customer needs are evolving and impact on packaging; risk/reward for OEMs considering innovative packaging; and how healthcare packaging markets can be characterized differently based upon their use. For more information on the conference click here https://www.packaging-future.com/agenda.

Posted in
input search string and hit enter